Packaging challenges in next generation coherent line sides components

Robert Blum

doi:10.1364/OFC.2014.W4I.2

Optical Fiber Communication Conference
OSA Technical Digest (online) (Optica Publishing Group, 2014),
paper W4I.2
•https://doi.org/10.1364/OFC.2014.W4I.2

Packaging challenges in next generation coherent line sides components

Robert Blum

Optical Fiber Communication Conference 2014

San Francisco, California United States
9–13 March 2014
ISBN: 978-1-55752-993-0

From the session
Symposium on Advanced Electro-optic Packaging and Assembly Technologies II (W4I)

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R. Blum, "Packaging challenges in next generation coherent line sides components," in Optical Fiber Communication Conference, OSA Technical Digest (online) (Optica Publishing Group, 2014), paper W4I.2.

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Abstract

Starting from lessons learned in the 10G and 40G space we’ll present different packaging approaches for these new 100G coherent modules and sub-components and discuss packaging design trade-offs based on thermal and RF simulations. Article not available.

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