Device Technologies for Integrated Packaged Transceivers

Robert A. Griffin

doi:10.1364/OFC.2015.W1H.2

Optical Fiber Communication Conference
OSA Technical Digest (online) (Optica Publishing Group, 2015),
paper W1H.2
•https://doi.org/10.1364/OFC.2015.W1H.2

Device Technologies for Integrated Packaged Transceivers

Robert A. Griffin

Optical Fiber Communication Conference 2015

Los Angeles, California United States
22–26 March 2015
ISBN: 978-1-55752-937-4

From the session
Beyond the Gold Box: The Future of Integrated Optics I (W1H)

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R. A. Griffin, "Device Technologies for Integrated Packaged Transceivers," in Optical Fiber Communication Conference, OSA Technical Digest (online) (Optica Publishing Group, 2015), paper W1H.2.

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Abstract

InP based PICs have enabled a first generation of CFP2-ACO modules for line-side 100Gb/s deployment. A number of options are available to scale to higher volumes and enable high density transport up to 400Gb/s.

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