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Photonic Packaging in High-Throughput Microelectronic Assembly Lines for Cost-Efficiency and Scalability

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Abstract

We demonstrate silicon photonic packaging that can be fully exercised in existing microelectronic packaging facilities. We show low optical loss and point towards notably improved assembly cost and scalability in both volume and optical port-count.

© 2015 Optical Society of America

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More Like This
High-Throughput Photonic Packaging

Tymon Barwicz, Ted W. Lichoulas, Yoichi Taira, Yves Martin, Shotaro Takenobu, Alexander Janta-Polczynski, Hidetoshi Numata, Eddie L. Kimbrell, Jae-Woong Nah, Bo Peng, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Paul Fortier, and Nicolas Boyer
Tu3K.4 Optical Fiber Communication Conference (OFC) 2017

Automated Assembly of Duplex Fiber Connectors to Photonic Chips in Standard Microelectronic Tools

Ted W. Lichoulas, Eddie L. Kimbrell, Alexander Janta-Polczynski, Elaine Cyr, Paul Fortier, Nicolas Boyer, and Tymon Barwicz
STh4B.8 CLEO: Science and Innovations (CLEO_SI) 2018

Optical Demonstration of a Compliant Polymer Interface between Standard Fibers and Nanophotonic Waveguides

Tymon Barwicz, Yoichi Taira, Shotaro Takenobu, Nicolas Boyer, Alexander Janta-Polczynski, Yan Thibodeau, Swetha Kamlapurkar, Sebastian Engelmann, Hidetoshi Numata, Robert L. Bruce, Simon Laflamme, Paul Fortier, and Yurii A. Vlasov
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