2D and 3D Heterogeneous Photonic Integrated Circuits

S. J. Ben Yoo

doi:10.1364/OFC.2016.Th1C.5

Optical Fiber Communication Conference
OSA Technical Digest (online) (Optica Publishing Group, 2016),
paper Th1C.5
•https://doi.org/10.1364/OFC.2016.Th1C.5

2D and 3D Heterogeneous Photonic Integrated Circuits

S. J. Ben Yoo

Optical Fiber Communication Conference 2016

Anaheim, California United States
20–22 March 2016
ISBN: 978-1-943580-07-1

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Switches and Optical Signal Processing Devices (Th1C)

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S. J. Ben Yoo, "2D and 3D Heterogeneous Photonic Integrated Circuits," in Optical Fiber Communication Conference, OSA Technical Digest (online) (Optica Publishing Group, 2016), paper Th1C.5.

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Abstract

This paper reviews 2D and 3D photonic integrated circuits and their applications in computing, networking, and signal processing. Various novel fabrication techniques leading to realization of chip-scale microsystems, and future prospects will also be discussed.

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