Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
Conferences > OFC > 2017 > Th5D > Th5D.6

8-channel 448 Gbit/s Silicon Photonic Transmitter Enabled by Photonic Wire Bonding

M. R. Billah, M. Blaicher, J. N. Kemal, T. Hoose, H. Zwickel, P-I. Dietrich, U. Troppenz, M. Moehrle, F. Merget, A. Hofmann, J. Witzens, S. Randel, W. Freude, and C. Koos

Not Accessible

Your library or personal account may give you access

Abstract

We demonstrate an eight-channel hybrid multi-chip module comprising InP lasers, silicon photonic modulators, and parallel single-mode fibers, all connected via photonic wire bonds. We transmit 28 GBd PAM-4 signals at a total data rate of 448 Gbit/s over 2 km.

© 2017 Optical Society of America

PDF Article
More Like This
Silicon-organic hybrid integration and photonic wire bonding: Enabling technologies for heterogeneous photonic systems

C. Koos, W. Freude, J. Leuthold, L. Alloatti, R. Palmer, D. Korn, J. Pfeifle, P. C. Schindler, M. Lauermann, N. Lindenmann, S. Koeber, T. Hoose, M. R. Billah, H. Yu, W. Bogaerts, R. Baets, M. Fournier, J.-M. Fedeli, R. Dinu, J. Bolten, T. Wahlbrink, and M. Waldow
FTu1E.3 Frontiers in Optics (FiO) 2013

Integrated 5-channel WDM hybrid III-V/Si transmitter enabling 100Gb/s and beyond

G. de Valicourt, C. M. Chang, S. Chandrasekhar, Y. K. Chen, A. Maho, R. Brenot, and P. Dong
Th1B.4 Optical Fiber Communication Conference (OFC) 2017

Photonic wire bonding: An enabling technology for heterogeneous multi-chip integration

C. Koos, W. Freude, J. Leuthold, N. Lindenmann, S. Koeber, J. Hoffmann, T. Hoose, P. Huebner, and M. R. Billah
IM4A.3 Integrated Photonics Research, Silicon and Nanophotonics (IPR) 2013

View More...
Select as filters
Select Topics Cancel
Top
       
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.
Privacy | Terms of Use