Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

A 137-mW, 4 ch × 25-Gbps Low-Power Compact Transmitter Flip-Chip-Bonded 1.3-μm LD-Array-on-Si

Not Accessible

Your library or personal account may give you access

Abstract

A low-power compact 4-channel transmitter consisting of a 65-nm CMOS cascode shunt LD driver and flip-chip-bonded 1.3-μm LD-array-on-Si achieves 25-Gbps 2-km-long SSMF error-free operation for each channel, with power consumption of 1.37 mW/Gbps.

© 2018 The Author(s)

PDF Article
More Like This
A 0.57-mW/Gbps, 2ch x 53-Gbps Low-Power PAM4 Transmitter Front-End Flip-Chip-Bonded 1.3-μm LD-Array-on-Si

Toshiki Kishi, Munehiko Nagatani, Shigeru Kanazawa, Kota Shikama, Takuro Fujii, Hidetaka Nishi, Hiroshi Yamazaki, Norio Sato, Hideyuki Nosaka, and Shinji Matsuo
W3G.4 Optical Fiber Communication Conference (OFC) 2020

A 25-Gbps×4 ch, Low-Power Compact Wire-Bond-Free 3D-Stacked Transmitter Module with 1.3-μm LD-Array-on- Si for On-Board Optics

Toshiki Kishi, Hitoshi Wakita, Kota Shikama, Munehiko Nagatani, Shigeru Kanazawa, Takuro Fujii, Hidetaka Nishi, Hiroshi Ishikawa, Yuko Kawajiri, Atsushi Aratake, Hideyuki Nosaka, Hiroshi Fukuda, and Shinji Matsuo
Tu2I.1 Optical Fiber Communication Conference (OFC) 2019

30-Gbps/ch x 4 ch Simultaneous Error-Free Transmission with A Low-Power Transmitter Flip-Chip-Bonded 1.3-µm LD-Array-on-Si

Toshiki Kishi, Munehiko Nagatani, Shigeru Kanazawa, Kota Shikama, Takuro Fujii, Hidetaka Nishi, Tadashi Minotani, Norio Sato, Toru Segawa, and Shinji Matsuo
M4E.2 Optical Fiber Communication Conference (OFC) 2023

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All Rights Reserved