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Multi-core Fiber Socket-Assisted Packaging for 84-Channel Ultra-dense Silicon Photonics IO

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Abstract

A femtosecond-laser 3D structured silica chip with alignment sockets has permitted precise and compact packaging of multi-core fiber for edge coupling to silicon photonic chips, with average single-pass loss of ~5.6 dB over 84 channels.

© 2019 The Author(s)

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