Microwave Photonic Subsystems-on-Chip

Siva Yegnanarayanan; Dave Kharas; Jason Plant; Cheryl Sorace-Agaskar; Paul Juodawlkis

doi:10.1364/OFC.2019.Tu3I.3

Optical Fiber Communication Conference (OFC) 2019
OSA Technical Digest (Optica Publishing Group, 2019),
paper Tu3I.3
•https://doi.org/10.1364/OFC.2019.Tu3I.3

Microwave Photonic Subsystems-on-Chip

Siva Yegnanarayanan, Dave Kharas, Jason Plant, Cheryl Sorace-Agaskar, and Paul Juodawlkis

Optical Fiber Communication Conference 2019

San Diego, California United States
3–7 March 2019
ISBN: 978-1-943580-53-8

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Microwave Photonic Chip-scale Subsystems (Tu3I)

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S. Yegnanarayanan, D. Kharas, J. Plant, C. Sorace-Agaskar, and P. Juodawlkis, "Microwave Photonic Subsystems-on-Chip," in Optical Fiber Communication Conference (OFC) 2019, OSA Technical Digest (Optica Publishing Group, 2019), paper Tu3I.3.

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Abstract

Microwave photonic subsystems are rapidly evolving from discrete to chip-scale implementations, enabled by the tight integration of active/passive photonic integrated circuits into multi-chip-modules. This paper reviews the recent advances in this field.

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