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Conferences > OFC > 2021 > M5A > M5A.2

Hybrid III-V laser integration on a monolithic silicon photonic platform

Yusheng Bian, Koushik Ramachandran, Bo Peng, Brittany Hedrick, Scott Mills, Keith Donegan, Armand Rundquist, Ed Vail, Vaishnavi Karra, Firat Yasar, Monica Esopi, Benjamin Fasano, Asli Sahin, Thomas Houghton, Karen Nummy, Hanyi Ding, Takako Hirokawa, Kevin Dezfulian, Zhuojie Wu, Daniel Fisher, Jim Pape, Jay Steffes, Louis Medina, Subharup Gupta Roy, Harry Cox, Bart Green, Jorge Lubguban, Won Suk Lee, Abdelsalam Aboketaf, Michal Rakowski, et al.

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    Y. Bian, K. Ramachandran, B. Peng, B. Hedrick, S. Mills, K. Donegan, A. Rundquist, E. Vail, V. Karra, F. Yasar, M. Esopi, B. Fasano, A. Sahin, T. Houghton, K. Nummy, H. Ding, T. Hirokawa, K. Dezfulian, Z. Wu, D. Fisher, J. Pape, J. Steffes, L. Medina, S. G. Roy, H. Cox, B. Green, J. Lubguban, W. S. Lee, A. Aboketaf, M. Rakowski, K. McLean, Z. Sowinski, O. Kwon, G. Robert, M. Sorbara, S. Krishnamurthy, A. Stricker, J. K. Cho, I. Melville, D. Riggs, R. Augur, N. Robson, D. Berger, L. Lee, V. Gupta, A. Yu, K. Giewont, T. Letavic, and J. Pellerin, "Hybrid III-V laser integration on a monolithic silicon photonic platform," in Optical Fiber Communication Conference (OFC) 2021, P. Dong, J. Kani, C. Xie, R. Casellas, C. Cole, and M. Li, eds., OSA Technical Digest (Optica Publishing Group, 2021), paper M5A.2.
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Abstract

We report a hybrid flip-chip-integrated laser attach technology on a monolithic SiPh platform. Efficient laser-to-PIC butt-coupling with optical power up to 11dBm was demonstrated through a combination of precise mechanical stops and optical alignment features.

© 2021 The Author(s)

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