8 Tbps Co-Packaged FPGA and Silicon Photonics Optical IO

Kaveh Hosseini; Edwin Kok; Sergey Y. Shumarayev; Chia-Pin Chiu; Arnab Sarkar; Asako Toda; Yanjing Ke; Allen Chan; Daniel Jeong; Mason Zhang; Sangeeta Raman; Thungoc Tran; Kumar Abhishek Singh; Pavan Bhargava; Chong Zhang; Haiwei Lu; Ravi Mahajan; Xiaoqian Li; Nitin Deshpande; Conor O’Keeffe; Uma Krishnamoorthy; Chen Sun; Roy Meade; Vladimir Stojanovic; Mark Wade

doi:10.1364/OFC.2021.Th4A.2

Optical Fiber Communication Conference (OFC) 2021
OSA Technical Digest (Optica Publishing Group, 2021),
paper Th4A.2
•https://doi.org/10.1364/OFC.2021.Th4A.2

8 Tbps Co-Packaged FPGA and Silicon Photonics Optical IO

Kaveh Hosseini, Edwin Kok, Sergey Y. Shumarayev, Chia-Pin Chiu, Arnab Sarkar, Asako Toda, Yanjing Ke, Allen Chan, Daniel Jeong, Mason Zhang, Sangeeta Raman, Thungoc Tran, Kumar Abhishek Singh, Pavan Bhargava, Chong Zhang, Haiwei Lu, Ravi Mahajan, Xiaoqian Li, Nitin Deshpande, Conor O’Keeffe, Uma Krishnamoorthy, Chen Sun, Roy Meade, Vladimir Stojanovic, and Mark Wade

Optical Fiber Communication Conference 2021

Washington, DC United States
6–11 June 2021
ISBN: 978-1-943580-86-6

From the session
Advanced Photonic Integration and Co-packaging (Th4A)

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K. Hosseini, E. Kok, S. Y. Shumarayev, C. Chiu, A. Sarkar, A. Toda, Y. Ke, A. Chan, D. Jeong, M. Zhang, S. Raman, T. Tran, K. A. Singh, P. Bhargava, C. Zhang, H. Lu, R. Mahajan, X. Li, N. Deshpande, C. O’Keeffe, U. Krishnamoorthy, C. Sun, R. Meade, V. Stojanovic, and M. Wade, "8 Tbps Co-Packaged FPGA and Silicon Photonics Optical IO," in Optical Fiber Communication Conference (OFC) 2021, P. Dong, J. Kani, C. Xie, R. Casellas, C. Cole, and M. Li, eds., OSA Technical Digest (Optica Publishing Group, 2021), paper Th4A.2.

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Abstract

The first 8 Tbps co-packaged FPGA with Silicon-Photonics IO is presented paving the way for co-packaged compute and optical-IO. The Multi-Chip Package integrates Stratix® 10 FPGA with up to five optical IO chiplets.

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