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Conferences > OFC > 2022 > M3D > M3D.4

Uncooled 100 GBd O-Band EML for Datacom Transmitter Arrays

Ute Troppenz, Michael Theurer, Martin Moehrle, Ariane Sigmund, Marko Gruner, and Martin Schell

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Abstract

100 GBd is demonstrated from 30°C to 70°C with O-Band InP EML array chips. Modulation bandwidths are above 50 GHz, and an integrated SOA ensures 10 dBm, while a single active layer allows for cost effective manufacturing.

© 2022 The Author(s)

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