Device Engineering and Performance Optimization of Silicon PICs for 800Gb/s Coherent Transmission

Hao Wu; Chen Zhu; Ning Cheng; Chenlei Li; Min Teng; Pan Sun; Feng Wang; Yinchao Du; Gang Cheng; Xuezhe Zheng

doi:10.1364/OFC.2023.Th2A.22

Optical Fiber Communication Conference (OFC) 2023
Technical Digest Series (Optica Publishing Group, 2023),
paper Th2A.22
•https://doi.org/10.1364/OFC.2023.Th2A.22

Device Engineering and Performance Optimization of Silicon PICs for 800Gb/s Coherent Transmission

Hao Wu, Chen Zhu, Ning Cheng, Chenlei Li, Min Teng, Pan Sun, Feng Wang, Yinchao Du, Gang Cheng, and Xuezhe Zheng

Optical Fiber Communication Conference 2023

San Diego California United States
5–9 March 2023
ISBN: 978-1-957171-18-0

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Posters Session III, In-Person (Th2A)

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H. Wu, C. Zhu, N. Cheng, C. Li, M. Teng, P. Sun, F. Wang, Y. Du, G. Cheng, and X. Zheng, "Device Engineering and Performance Optimization of Silicon PICs for 800Gb/s Coherent Transmission," in Optical Fiber Communication Conference (OFC) 2023, Technical Digest Series (Optica Publishing Group, 2023), paper Th2A.22.

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Abstract

An end-to-end link model is developed to optimize silicon PIC and evaluate the coherent system performance. 128Gbaud 16-QAM data transmission based on silicon photonics is achieved with -9.1dBm Tx-output power and 26dB Rx OSNR sensitivity.

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