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Conferences > OFC > 2023 > Th2A > Th2A.8

Low Insertion Loss 128-Gbaud HB-CDM with 3D-Printed Spot Size Converter Integrated InP-based Modulator

Yasutaka Mizuno, Munetaka Kurokawa, Naoki Itabashi, Taichi Misawa, Masaru Takechi, Hiroshi Uemura, Hajime Tanaka, Tsutomu Ishikawa, Tomoya Saeki, Keiji Tanaka, Takatoshi Kato, Manabu Shiozaki, and Katsumi Uesaka

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Abstract

We demonstrate 128 Gbaud HB-CDM with InP-based modulator having 3D-printed SSCs on chip facet. Optical coupling loss of 1.1 dB and Telcordia compliant reliability promise practical usage of 3D-print technology based on two photon polymerization.

© 2023 The Author(s)

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