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Conferences > OFS > 2022 > W4 > W4.66

Hermetic Fiber Sensor Packaging through Pressure Boundary for Harsh Environment Applications

Shuda Zhong, Kehao Zhao, Zhichun Fan, Wu Jingyu, Yuqi Li, Qirui Wang, and Kevin P. Chen

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Abstract

This paper presents a hermetic fiber sensor packaging technique using glass sealants through pressure boundaries for harsh environment applications. The embedded fiber sensors are leak-proof at 1MPa at temperatures up to 220oC.

© 2022 The Author(s)

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