Abstract

The mechanics of grinding and polishing are fundamentally similar: both rely on randomly oriented diamond particles for material removal. The basic difference between the processes is that grinding uses a fixed abrasive, while polishing uses a loose abrasive. The difference in material removal mechanisms for grinding (brittle) and polishing (ductile) of optical materials is intriguing, especially in view of the similarities between the two processes. This similarity brings up an important question: can the material removal mechanism be changed from one of fracture to one of plastic deformation in the grinding of brittle materials? This possibility of a brittle-ductile transition in material removal is the central concern of microgrinding research, and is the subject of this paper.

© 1988 Optical Society of America