Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

Machine Vision System for Measuring Subsurface Damage

Not Accessible

Your library or personal account may give you access


The dimpling technique is widely used to measure subsurface damage SSD. The ground surface is first acid etched to open up the fractures. A dimple is polished into the surface by a sphere of a known diameter, and the diameters of the circular zones with and without visible subsurface fractures are measured to determined the damage depth. The measuring system consists of a microscope with a reticule and a linear translation stage. The diameters of the various zones are visually interpreted and measured. The dimpling technique provides a direct measurement of SSD, as opposed to other techniques where the SSD is implied from other properties such as scattering. The manual measurements associated with this technique are tedious and requires a trained operator to identify the deepest fracture.

© 1992 Optical Society of America

PDF Article
More Like This
Subsurface Damage: Comparison of Automated and Visual Measurements

Matthew T. Chang, John E. Greivenkamp, Arne Lindquist, and Tim M. Rich
OMD4 Optical Fabrication and Testing (OF&T) 1994

Non-Destructive Estimation of Subsurface Glass Damage Using Fluorescent Confocal Microscopy

Warren E. Smith, Thu-Huong Bui, Arne Lindquist, and Stephen D. Jacobs
WB12 Optical Fabrication and Testing (OF&T) 1992

Role of etching in measurement of subsurface damage by SEM and optical microscopy

Y.Y. Zhou, P.D. Funkenbusch, D.J. Quesnel, D. Golini, and A. Lindquist
OMD3 Optical Fabrication and Testing (OF&T) 1994

Select as filters

Select Topics Cancel
© Copyright 2023 | Optica Publishing Group. All Rights Reserved