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Conferences > OFT > 2002 > OMB > OMB7

Polishing high aspect ratio substrates for optics, telecommunications, and microelectronics applications using magnetorheological finishing (MRF)

Marc Tricard, Mike DeMarco, and Don Golini

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Abstract

Precise flatness or thickness control is extremely difficult to achieve for substrates with a high diameter to thickness ratio. MRF is able to polish high aspect ratio substrates for telecommunications and microelectronic applications to the nanometer level.

© 2002 Optical Society of America

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