Abstract
EUVL, i.e. microlithography at 13nm is one of the most likely technologies to satisfy the requirements of the 50nm-node and below of the IC-manufacturing roadmap The development of the first step and scan machines meeting production requirements of field size and resolution is in progress. A key component of these machines will be a diffraction limited, off-axis mirror system with aspherical surfaces.
© 2002 Optical Society of America
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