Abstract
In this work, the film crack defect is described in details when observed during the development of an infrared film product. In consideration of the forming mechanism of film crack, DOE is conducted on different factors of material, substrate temperature and stack design, etc. Finally, the suitable design and process settings are built to eliminate film crack with the spectrum meeting customer requirements, successfully delivered infrared film products to volume production.
© 2016 Optical Society of America
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