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Quantitative Calculation of Substrate Bending Caused by Multilayer Thin Film Stress

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Abstract

Substrate bending by multilayer coating of Ta2O5/SiO2 has been investigated quantitatively. By introducing fitting parameters to modified Stoney’s formula, the amount of the bending has been calculated to accuracies of less than 𝜆⁄10 at 633nm.

© 2019 The Author(s)

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