Abstract

The high-throughput spatial light modulator (SLM) is a key component in an expanding range of optical signal processing applications and VLSI interconnect scenarios. With the continuing trend towards overall system integration, a number of approaches have been pursued in recent years, with the common aim of developing a silicon-compatible modulator system, preferably addressed via a fully integrated silicon back-plane with a 1:1 mapping between drive circuits and modulation elements. Potentially viable technologies investigated hitherto include liquid crystals [1,2,3], magneto optic materials.[4] and micromechanical devices fabricated in silicon itself [5], all of which exhibit relatively limited modulation rates.

© 1989 Optical Society of America