Abstract
With recent progress in semiconductor arrays of opto-electronic bistable devices and sources, highly parallel optical interconnections and information processing has gradually become a reality. The Vertical to Surface Transmission Electro-Photonic device, or VSTEP, is a concept proposed to meet these requirements1). The essential ideas for the VSTEP are electrophotonic interfusion at the device level and the resulting performance efficiency improvements in power consumption and uniformity for two-dimensional matrix integration.
© 1991 Optical Society of America
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