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Optica Publishing Group
  • Conference on Lasers and Electro-Optics/International Quantum Electronics Conference and Photonic Applications Systems Technologies
  • Technical Digest (CD) (Optica Publishing Group, 2004),
  • paper PThA2

1064 nm infrared laser ablation of silicon wafer with a water film flowing through the ablated spot

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Abstract

With a water film flowing through the ablated spot, 1064 nm infrared laser ablation of silicon wafer demonstrated material volume removal rate of 0.2 mm3/sec and a small heat-affected-zone for wafer slotting.

© 2004 Optical Society of America

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