Abstract
Chemically assisted thermally enhanced laser direct write etch technology produces vertically walled 20 µm via structures in semi-insulating substrates at 20 µm/sec drilling speed highly surpassing drilling speed of ICP or DRIE at 0.5-2 µm/min. Diffractive optic focusing excimer-based ablation technology produces 25 µm diameter vias in 50 µm-thick polyimide film at the highest rate known up-to-date of 1500 vias/sec.
© 2004 Optical Society of America
PDF ArticleMore Like This
Elizabeth K. Illy, Michael J. Withford, Daniel J.W. Brown, and James A. Piper
CThA6 The European Conference on Lasers and Electro-Optics (CLEO/Europe) 1998
Jim Fieret
PTuE2 Photonic Applications Systems Technologies Conference (CLEO:A&T) 2004
Tyson N. Kim, Alexander Groisman, David Kleinfeld, and Chris B. Schaffer
ThCC4 Frontiers in Optics (FiO) 2003