Abstract
Applications of laser repair for integrated circuits (IC) chips, which exhibit large-scale redundancy in their designs, have been improved for yield enhancement [1]. A short pulse laser is employed to remove defective elements and replace them with redundant ones. In present semiconductor manufacturing, the laser is general used to cut metal lines, but it has become increasingly difficult with the development of multilevel metallization processes. The lower corner cracks of the metal lines were demonstrated to be unfavorable for the electrical disconnection of the fuse, because it leads to the low yields and eventually becomes the limit for the laser energy process window [2].
© 2005 Optical Society of America
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