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  • Conference on Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference and Photonic Applications Systems Technologies
  • OSA Technical Digest (CD) (Optica Publishing Group, 2008),
  • paper JWA1

Excimer Laser Micromachining of Glass Substrates

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Abstract

Excimer laser machining of microvias and tracks in CMZ glass (100 μm thick) at 248 nm has been investigated and optimised in order to minimise hole taper, microcracking and debris.

© 2008 Optical Society of America

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