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High throughput opto-electronic VLSI switching chips

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Abstract

As the demand for telecommunications services continues to increase, the need to switch large bandwidths of data becomes important. While purely electronic solutions are possible, photonic solutions, using the integration of electronics with optical I/O (smart pixels), provides the potential for smaller physical volume, lower latency, lower power dissipation, and lower cost. We describe initial results from two opto-electronic switching chips, one with 1024 differential optical inputs and 1024 differential optical outputs with individual channels tested above 600 Mb/s and a second with 512 differential optical inputs and outputs with individual channels tested up to 900 Mb/s. The technology for the chip consists of flip-chip bonding of 850 nm GaAs/AlGaAs multiple quantum well (MQW) detectors and modulators onto silicon CMOS with substrate removal to allow access to the optical devices [1]

© 1997 Optical Society of America

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