Circuit architecture and integration feasibility of a high-resolution broadband on-chip spectral sensor

Mehedi Hasan; Mohammad Rad; Gazi Mahamud Hasan; Houman Ghorbani; Peng Liu; Patric dumais; Eric Bernier; Trevor Hall

doi:10.1364/SPPCOM.2020.SpM3I.1

OSA Advanced Photonics Congress (AP) 2020 (IPR, NP, NOMA, Networks, PVLED, PSC, SPPCom, SOF)
OSA Technical Digest (Optica Publishing Group, 2020),
paper SpM3I.1
•https://doi.org/10.1364/SPPCOM.2020.SpM3I.1

Circuit architecture and integration feasibility of a high-resolution broadband on-chip spectral sensor

Mehedi Hasan, Mohammad Rad, Gazi Mahamud Hasan, Houman Ghorbani, Peng Liu, Patric dumais, Eric Bernier, and Trevor Hall

Signal Processing in Photonic Communications 2020

Washington, DC United States
13–16 July 2020
ISBN: 978-1-943580-79-8

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Devices and Components (SpM3I)

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M. Hasan, M. Rad, G. M. Hasan, H. Ghorbani, P. Liu, P. dumais, E. Bernier, and T. Hall, "Circuit architecture and integration feasibility of a high-resolution broadband on-chip spectral sensor," in OSA Advanced Photonics Congress (AP) 2020 (IPR, NP, NOMA, Networks, PVLED, PSC, SPPCom, SOF), L. Caspani, A. Tauke-Pedretti, F. Leo, and B. Yang, eds., OSA Technical Digest (Optica Publishing Group, 2020), paper SpM3I.1.

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Abstract

On-chip spectral monitoring of dense multi-carrier superchannels in flex grid architectures across the entire C-band is challenging. A compact architecture, integration feasibility and simulation verification targeting high resolution is presented.

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