Solid State UV Laser and Its Application in Electronic Packaging

Yunlong Sun; Ed Swenson

doi:10.1364/SSLMA.1997.WA2

Solid State Lasers: Materials and Applications
Technical Digest Series (Optica Publishing Group, 1997),
paper WA2
•https://doi.org/10.1364/SSLMA.1997.WA2

Solid State UV Laser and Its Application in Electronic Packaging

Yunlong Sun and Ed Swenson

Solid State Lasers: Materials and Applications 1997

Tianjin China
8–11 July 1997
ISBN:

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Nonlinear Technology (WA)

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Y. Sun and E. Swenson, "Solid State UV Laser and Its Application in Electronic Packaging," in Solid State Lasers: Materials and Applications, Technical Digest Series (Optica Publishing Group, 1997), paper WA2.

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Abstract

Traditional mechanical drilling for making vias in a variety of dielectric materials, such as RF4, polimide, etc. and copper sheet are good for the via diameter greater than 200 micron.

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