Double-loop control and intelligent parameter tuning for the temperature control system of a DBR semiconductor laser

Xiufei Li; Zhuo Wang; Zhuo Wang; Zhuo Wang; Wei Chen; Xiaolin Ning; Xiaolin Ning; Wei Quan; Wei Quan; Yueyang Zhai; Yueyang Zhai; Yueyang Zhai

doi:10.1364/AO.409600

Applied Optics
Vol. 60,
Issue 2,
pp. 326-332
(2021)
•https://doi.org/10.1364/AO.409600

Double-loop control and intelligent parameter tuning for the temperature control system of a DBR semiconductor laser

Xiufei Li, Zhuo Wang, Wei Chen, Xiaolin Ning, Wei Quan, and Yueyang Zhai

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Xiufei Li, Zhuo Wang, Wei Chen, Xiaolin Ning, Wei Quan, and Yueyang Zhai, "Double-loop control and intelligent parameter tuning for the temperature control system of a DBR semiconductor laser," Appl. Opt. 60, 326-332 (2021)

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Related Topics
Table of Contents Category
- Lasers, Optical Amplifiers, and Laser Optics
Optics & Photonics Topics
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The topics in this list come from the Optics and Photonics Topics applied to this article.

About this Article
History
- Original Manuscript: September 10, 2020
- Revised Manuscript: November 23, 2020
- Manuscript Accepted: November 23, 2020
- Published: January 6, 2021

Abstract

Aiming at lower startup power consumption, stronger thermal load adaptability, easier parameters adjustment, and higher parameter tuning efficiency for the temperature control system of a distributed Bragg reflector (DBR) semiconductor laser, this paper employs the double-loop control and intelligent parameter tuning methods. First, the thermal equivalent circuit model is established for the laser temperature control system, which has stronger thermal load adaptability than the traditional transfer function model. In order to improve the modeling speed and accuracy, a mean impact value (MIV) quantum particle swarm optimization (QPSO) intelligent algorithm is proposed to tune the model parameters. A double-loop temperature control system is set up on this basis. Then, the MIV-QPSO intelligent algorithm is used to tune the control parameters, which shortens the settling time, increases the tuning efficiency, and improves the temperature control effect. The feasibility and effectiveness of the proposed methods are verified through the MATLAB/Simulink simulation of the laser temperature control process.

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Method/Static Parameters	$Θ_{m}$	$R_{m}$	$α_{m}$
Simon–Sam method	56.37	2.0818	0.10
MIV-QPSO method	57.18	2.2589	0.01034

Symbol	Quantity	Value
$R_{m}$	TEC equivalent resistance ( $Ω$ )	2.25889 ^a
$Θ_{m}$	TEC thermal resistance ( $K / W$ )	57.18252
$α_{m}$	the TEC average Seebeck coefficient	0.01034
$R_{L D}$	Equivalent thermal resistance of laser chip	72.35014
$R_{s u b m o u n t}$	Equivalent thermal resistance of submount	0.51451
$R_{C a n}$	Equivalent thermal resistance of laser module can	0.29455
$R_{H S 1}$	Equivalent thermal resistance of LD hold-down mechanism	0.05638
$R_{H S 2}$	Equivalent thermal resistance of laser heat sink	0.02499
$C 1$	Heat capacity of TEC cold end	0.0061
$C 2$	Heat capacity of TEC hot end	0.0188
$C_{L D}$	Equivalent heat capacity resistance of laser chip	0.0053
$C_{s u b m o u n t}$	Equivalent heat capacity resistance of submount	0.04430
$C_{C a n}$	Equivalent heat capacity resistance of laser module can	0.1417
$C_{H S 1}$	Equivalent heat capacity resistance of LD hold-down mechanism	16.4367
$C_{H S 2}$	Equivalent heat capacity resistance of laser heat sink	59.2911
$K_{T}$	Temperature PI controller	1.0133
$I_{T}$	Temperature PI controller	0.3683
$K_{C}$	Current PI controller	0.4620
$I_{C}$	Current PI controller	0.6709

Method/Static Parameters	$Θ_{m}$	$R_{m}$	$α_{m}$
Simon–Sam method	56.37	2.0818	0.10
MIV-QPSO method	57.18	2.2589	0.01034

Symbol	Quantity	Value
$R_{m}$	TEC equivalent resistance ( $Ω$ )	2.25889 ^a
$Θ_{m}$	TEC thermal resistance ( $K / W$ )	57.18252
$α_{m}$	the TEC average Seebeck coefficient	0.01034
$R_{L D}$	Equivalent thermal resistance of laser chip	72.35014
$R_{s u b m o u n t}$	Equivalent thermal resistance of submount	0.51451
$R_{C a n}$	Equivalent thermal resistance of laser module can	0.29455
$R_{H S 1}$	Equivalent thermal resistance of LD hold-down mechanism	0.05638
$R_{H S 2}$	Equivalent thermal resistance of laser heat sink	0.02499
$C 1$	Heat capacity of TEC cold end	0.0061
$C 2$	Heat capacity of TEC hot end	0.0188
$C_{L D}$	Equivalent heat capacity resistance of laser chip	0.0053
$C_{s u b m o u n t}$	Equivalent heat capacity resistance of submount	0.04430
$C_{C a n}$	Equivalent heat capacity resistance of laser module can	0.1417
$C_{H S 1}$	Equivalent heat capacity resistance of LD hold-down mechanism	16.4367
$C_{H S 2}$	Equivalent heat capacity resistance of laser heat sink	59.2911
$K_{T}$	Temperature PI controller	1.0133
$I_{T}$	Temperature PI controller	0.3683
$K_{C}$	Current PI controller	0.4620
$I_{C}$	Current PI controller	0.6709

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Applied Optics