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  • Chinese Optics Letters
  • Vol. 20,
  • Issue 7,
  • pp. 071403-
  • (2022)

High peak power density and low mechanical stress photonic-band-crystal diode laser array based on non-soldered packaging technology

Jing Liu, Mingjin Wang, Yufei Wang, Xuyan Zhou, Ting Fu, Aiyi Qi, Hongwei Qu, Xiaoxu Xing, and Wanhua Zheng

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Abstract

A high peak power density and low mechanical stress photonic-band-crystal (PBC) diode laser array based on non-soldered packaging technology is demonstrated. The array consists of the PBC diode laser bars with small fast axis divergence angles. Meanwhile, we design the non-soldered array structure that realizes mechanical stacking of 10 bars in the vertical direction. In the experiment, the peak power density of the PBC array is about 1.75 times that of the conventional array when the same total power is obtained. The peak power of the non-soldered array is 292.2 W, and the “smile” effect is improved by adjusting the mechanical fixing force of the array.

© 2022 Chinese Laser Press

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