Abstract
Negative charge material, , has been fabricated to passivate the surface of p-type silicon. The fabrication of was possible by using ion beam sputtering deposition to deposit AlN thin film on the surface of a p-type silicon wafer and following annealing in oxygen ambient. Capacitance-voltage analysis shows the fixed charge density has increased from to after annealing. The solar cell efficiency increased from 15.9% to 17.3%, which is also equivalent to the reduction of surface recombination velocity from to 32 cm/s.
© 2011 Optical Society of America
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