Abstract

An advanced, ultra-thin, flexible LED (FLED) package technique is first proposed in this study, where a polyimide substrate was used as the lead frame package material due to its physical stability in thermal processing. The experimental results showed that the thickness of the mockup sample measured by a vernier caliper was 260 μm and 35% thinner than the Panasonic organic LED lighting panel announced on 4 March 2014 in Tokyo. Moreover, the flexible angle of the ultra-thin LED package was 200.54° when it surrounded a disk with a 1 cm radius. A design of a micro-lens array manufactured by silicone molding on the FLED is also proposed in this study. Finally, different types of micro-lenses were applied to different lighting regions to investigate their lighting effects.

© 2015 Optical Society of America

Design of compact freeform lens for application specific light-emitting diode packaging

Kai Wang, Fei Chen, Zongyuan Liu, Xiaobing Luo, and Sheng Liu
Opt. Express 18(2) 413-425 (2010)

Design of a brightness-enhancement-film-adaptive freeform lens to enhance overall performance in direct-lit light-emitting diode backlighting

Bin Xie, Run Hu, Qi Chen, Xingjian Yu, Dan Wu, Kai Wang, and Xiaobing Luo
Appl. Opt. 54(17) 5542-5548 (2015)

Freeform lens design for light-emitting diode uniform illumination by using a method of source–target luminous intensity mapping

Jin-Jia Chen, Ze-Yu Huang, Te-Shu Liu, Ming-Da Tsai, and Kuang-Lung Huang
Appl. Opt. 54(28) E146-E152 (2015)

Optical design of dental light using a remote phosphor light-emitting diode package for improving illumination uniformity

Sie-Wook Jeon, Sunghyun Kim, Jina Choi, Inseok Jang, Younghyun Song, Wan Ho Kim, and Jae Pil Kim
Appl. Opt. 57(21) 5998-6003 (2018)

Packaging of InGaN stripe-shaped light-emitting diodes

Y. Park, K. H. Li, W. Y. Fu, Y. F. Cheung, and H. W. Choi
Appl. Opt. 57(10) 2452-2458 (2018)