Abstract
In this work, a 280 nm AlGaN-based deep ultraviolet light-emitting diode (DUV LED) with a metal–insulator–semiconductor (MIS) structured n-electrode is fabricated and studied. The ${{\rm SiO}_2}$ insulator layer is adopted to form the MIS structure by using an atomic layer deposition system. After adopting the MIS-structured n-electrode, the ${{\rm SiO}_2}$ intermediate layer enables electron affinity for the contact metal to be higher than the conduction band of the n-AlGaN layer, which favors the electrons to be injected into the n-AlGaN layer by intraband tunneling rather than thermionic emission. Moreover, the thin ${{\rm SiO}_2}$ insulator can share the applied bias, which makes the n-AlGaN layer surface less depleted and thus further facilitates the electron injection. The improved electron injection capability at the metal–semiconductor interface helps reduce the contact resistance and increase electron concentration in the active region, which then improves external quantum efficiency and wall-plug efficiency for the proposed DUV LED.
© 2021 Optica Publishing Group
Full Article | PDF ArticleMore Like This
Chunshuang Chu, Danyang Zhang, Hua Shao, Jiamang Che, Kangkai Tian, Yonghui Zhang, and Zi-Hui Zhang
Opt. Mater. Express 11(6) 1713-1719 (2021)
Muhammad Nawaz Sharif, Muhammad Ajmal Khan, Qamar Wali, Pengfei Zhang, Fang Wang, and Yuhuai Liu
Appl. Opt. 61(31) 9186-9192 (2022)
Sai Pan, Kuili Chen, Yan Guo, Zexiang Liu, Yugang Zhou, Rong Zhang, and Youdou Zheng
Opt. Express 30(25) 44933-44942 (2022)