Abstract

Spatial resolution is an important aspect of many optical instruments. It is defined as the ability of surface-topography measuring instruments to distinguish closely spaced surface features. Following convention, spatial resolution can be defined as the spatial frequency response of the instrument, known as the instrument transfer function (ITF). In this paper, we describe the step-artifact approach for estimating the ITF for 3D scanners, discuss step artifact characterization and validation approaches, and present a method to estimate the combined uncertainty of the ITF measurement. The approach is demonstrated using the EinScan-Pro 3D scanner. A step artifact is used for the measurement that takes advantage of the cleaving properties of a single-side polished silicon wafer. The uncertainty analysis includes simulations to estimate the contribution due to influencing factors such as the alignment of the step artifact to the measurement axis, the diffuse versus specular scattering properties of the step edge, and various processing parameter choices.

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