Abstract

The periscope phone lens has a bright application prospect; however, the problem of a large chipping size in the grinding process for the periscope phone lens module components seriously limits its development. We address the problem of the large edge chipping size in the grinding process of small-sized module components of periscope mobile phone cameras by investigating the influence of the grinding speed, feed speed, and grinding depth on the chipping size through theoretical simulation analysis and single-factor variable experimental verification. The optimal grinding process parameters were preferred, and yield experiments were conducted using the preferred process parameters. The results show that increasing the grinding speed and decreasing the feed speed and grinding depth can effectively suppress the chipping size of the component grinding edge.

© 2022 Optica Publishing Group

Grinding of silicon carbide for optical surface fabrication, Part 1: surface analysis

Prithiviraj Shanmugam, John C. Lambropoulos, and Matthew A. Davies
Appl. Opt. 61(15) 4579-4590 (2022)

Ductile mode grinding of reaction-bonded silicon carbide mirrors

Zhichao Dong and Haobo Cheng
Appl. Opt. 56(26) 7404-7412 (2017)

Developing a trend prediction model of subsurface damage for fixed-abrasive grinding of optics by cup wheels

Zhichao Dong and Haobo Cheng
Appl. Opt. 55(32) 9305-9313 (2016)

Fluid hydrodynamic fixed abrasive grinding based on a small tool

PengFei Liu, Bin Lin, XiaoFeng Zhang, and Yan Li
Appl. Opt. 56(5) 1453-1459 (2017)

Study of deterministic surface micro-texture generation in ultra-precision grinding considering wheel oscillation

Shanshan Chen, Shuming Yang, Zhirong Liao, Chi Fai Cheung, Zhuangde Jiang, and Feihu Zhang
Opt. Express 30(4) 5329-5346 (2022)