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© 2017 Optical Society of Korea
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K. Kim, S. Kim, S. Kwon, and H. J. Pahk, “Volumetric thin film thickness measurement using spectroscopic imaging reflectometer and compensation of reflectance modeling error”, Int. J. Precis. Eng. Man. 15(9), 1817-1822 (2014).
[Crossref]
S. Kwon, N. Y. Kim, T. Jo, and H. J. Pahk, “Critical dimension measurement of transparent film layers by multispectral imaging”, Opt. Express 22, 17370-17381 (2014).
[Crossref]
M. Ohlidal, I. Ohlidal, P. Klapetek, D. Nečas, and A. Majumdar, “Measurement of the thickness distribution and optical constants of non-uniform thin films”, Meas. Sci. Technol. 22 (2011) 085104.
Y.-M. Hwang, S.-W. Yoon, J.-H. Kim, S. Kim, and H.-J. Pahk, “Thin-film thickness profile measurement using wavelet transform in wavelength-scanning interferometry”, Opt. Laser. Eng. 46, 179-184 (2008).
[Crossref]
M. Urbánek, J. Spousta, T. Běhounek, and T. Šikola, “Imaging reflectometry in situ”, Appl. Opt. 46, 6309-6313 (2007).
[Crossref]
D. Kim, S. Kim, H. J. Kong, Y. Lee, and Y. K. Kwak, “Fast thickness profile measurement using a peak detection method based on an acousto-optic tunable filter”, Meas. Sci. Technol. 13 (2002) L1.
T. E. Benson, L. I. Kamlet, P. Klimecky, and F. L. Terry, JR, “In-situ spectroscopic reflectometry for polycrystalline silicon thin film etch rate determination during reactive ion etching”, J. Electron. Mater. 25, 955-964 (1996).
[Crossref]
U. Schnell and R. Dӓndliker, “Dispersive white-light interferometry for absolute distance measurement with dielectric multilayer systems on the target”, Opt. Lett. 21, 528-530 (1996).
[Crossref]
T. Kihara and K. Yokomori, “Simultaneous measurement of refractive index and thickness of thin film by polarized reflectances”, Appl. Opt. 29, 5069-5073 (1990).
[Crossref]
A. Piegary and E. Masetti, “Thin film thickness measurement: a comparison of various techniques”, Thin Solid Films 124, 249-257 (1985).
[Crossref]
M. Urbánek, J. Spousta, T. Běhounek, and T. Šikola, “Imaging reflectometry in situ”, Appl. Opt. 46, 6309-6313 (2007).
[Crossref]
T. E. Benson, L. I. Kamlet, P. Klimecky, and F. L. Terry, JR, “In-situ spectroscopic reflectometry for polycrystalline silicon thin film etch rate determination during reactive ion etching”, J. Electron. Mater. 25, 955-964 (1996).
[Crossref]
U. Schnell and R. Dӓndliker, “Dispersive white-light interferometry for absolute distance measurement with dielectric multilayer systems on the target”, Opt. Lett. 21, 528-530 (1996).
[Crossref]
H. Fujiwara, Spectroscopic Ellipsometry: Principles and Applications, p. 43 (Wiley, New York, USA, 2007)
Y.-M. Hwang, S.-W. Yoon, J.-H. Kim, S. Kim, and H.-J. Pahk, “Thin-film thickness profile measurement using wavelet transform in wavelength-scanning interferometry”, Opt. Laser. Eng. 46, 179-184 (2008).
[Crossref]
S. Kwon, N. Y. Kim, T. Jo, and H. J. Pahk, “Critical dimension measurement of transparent film layers by multispectral imaging”, Opt. Express 22, 17370-17381 (2014).
[Crossref]
T. E. Benson, L. I. Kamlet, P. Klimecky, and F. L. Terry, JR, “In-situ spectroscopic reflectometry for polycrystalline silicon thin film etch rate determination during reactive ion etching”, J. Electron. Mater. 25, 955-964 (1996).
[Crossref]
T. Kihara and K. Yokomori, “Simultaneous measurement of refractive index and thickness of thin film by polarized reflectances”, Appl. Opt. 29, 5069-5073 (1990).
[Crossref]
D. Kim, S. Kim, H. J. Kong, Y. Lee, and Y. K. Kwak, “Fast thickness profile measurement using a peak detection method based on an acousto-optic tunable filter”, Meas. Sci. Technol. 13 (2002) L1.
Y.-M. Hwang, S.-W. Yoon, J.-H. Kim, S. Kim, and H.-J. Pahk, “Thin-film thickness profile measurement using wavelet transform in wavelength-scanning interferometry”, Opt. Laser. Eng. 46, 179-184 (2008).
[Crossref]
K. Kim, S. Kim, S. Kwon, and H. J. Pahk, “Volumetric thin film thickness measurement using spectroscopic imaging reflectometer and compensation of reflectance modeling error”, Int. J. Precis. Eng. Man. 15(9), 1817-1822 (2014).
[Crossref]
S. Kwon, N. Y. Kim, T. Jo, and H. J. Pahk, “Critical dimension measurement of transparent film layers by multispectral imaging”, Opt. Express 22, 17370-17381 (2014).
[Crossref]
K. Kim, S. Kim, S. Kwon, and H. J. Pahk, “Volumetric thin film thickness measurement using spectroscopic imaging reflectometer and compensation of reflectance modeling error”, Int. J. Precis. Eng. Man. 15(9), 1817-1822 (2014).
[Crossref]
Y.-M. Hwang, S.-W. Yoon, J.-H. Kim, S. Kim, and H.-J. Pahk, “Thin-film thickness profile measurement using wavelet transform in wavelength-scanning interferometry”, Opt. Laser. Eng. 46, 179-184 (2008).
[Crossref]
D. Kim, S. Kim, H. J. Kong, Y. Lee, and Y. K. Kwak, “Fast thickness profile measurement using a peak detection method based on an acousto-optic tunable filter”, Meas. Sci. Technol. 13 (2002) L1.
M. Ohlidal, I. Ohlidal, P. Klapetek, D. Nečas, and A. Majumdar, “Measurement of the thickness distribution and optical constants of non-uniform thin films”, Meas. Sci. Technol. 22 (2011) 085104.
T. E. Benson, L. I. Kamlet, P. Klimecky, and F. L. Terry, JR, “In-situ spectroscopic reflectometry for polycrystalline silicon thin film etch rate determination during reactive ion etching”, J. Electron. Mater. 25, 955-964 (1996).
[Crossref]
D. Kim, S. Kim, H. J. Kong, Y. Lee, and Y. K. Kwak, “Fast thickness profile measurement using a peak detection method based on an acousto-optic tunable filter”, Meas. Sci. Technol. 13 (2002) L1.
D. Kim, S. Kim, H. J. Kong, Y. Lee, and Y. K. Kwak, “Fast thickness profile measurement using a peak detection method based on an acousto-optic tunable filter”, Meas. Sci. Technol. 13 (2002) L1.
K. Kim, S. Kim, S. Kwon, and H. J. Pahk, “Volumetric thin film thickness measurement using spectroscopic imaging reflectometer and compensation of reflectance modeling error”, Int. J. Precis. Eng. Man. 15(9), 1817-1822 (2014).
[Crossref]
S. Kwon, N. Y. Kim, T. Jo, and H. J. Pahk, “Critical dimension measurement of transparent film layers by multispectral imaging”, Opt. Express 22, 17370-17381 (2014).
[Crossref]
D. Kim, S. Kim, H. J. Kong, Y. Lee, and Y. K. Kwak, “Fast thickness profile measurement using a peak detection method based on an acousto-optic tunable filter”, Meas. Sci. Technol. 13 (2002) L1.
M. Ohlidal, I. Ohlidal, P. Klapetek, D. Nečas, and A. Majumdar, “Measurement of the thickness distribution and optical constants of non-uniform thin films”, Meas. Sci. Technol. 22 (2011) 085104.
A. Piegary and E. Masetti, “Thin film thickness measurement: a comparison of various techniques”, Thin Solid Films 124, 249-257 (1985).
[Crossref]
M. Ohlidal, I. Ohlidal, P. Klapetek, D. Nečas, and A. Majumdar, “Measurement of the thickness distribution and optical constants of non-uniform thin films”, Meas. Sci. Technol. 22 (2011) 085104.
M. Ohlidal, I. Ohlidal, P. Klapetek, D. Nečas, and A. Majumdar, “Measurement of the thickness distribution and optical constants of non-uniform thin films”, Meas. Sci. Technol. 22 (2011) 085104.
M. Ohlidal, I. Ohlidal, P. Klapetek, D. Nečas, and A. Majumdar, “Measurement of the thickness distribution and optical constants of non-uniform thin films”, Meas. Sci. Technol. 22 (2011) 085104.
K. Kim, S. Kim, S. Kwon, and H. J. Pahk, “Volumetric thin film thickness measurement using spectroscopic imaging reflectometer and compensation of reflectance modeling error”, Int. J. Precis. Eng. Man. 15(9), 1817-1822 (2014).
[Crossref]
S. Kwon, N. Y. Kim, T. Jo, and H. J. Pahk, “Critical dimension measurement of transparent film layers by multispectral imaging”, Opt. Express 22, 17370-17381 (2014).
[Crossref]
Y.-M. Hwang, S.-W. Yoon, J.-H. Kim, S. Kim, and H.-J. Pahk, “Thin-film thickness profile measurement using wavelet transform in wavelength-scanning interferometry”, Opt. Laser. Eng. 46, 179-184 (2008).
[Crossref]
A. Piegary and E. Masetti, “Thin film thickness measurement: a comparison of various techniques”, Thin Solid Films 124, 249-257 (1985).
[Crossref]
U. Schnell and R. Dӓndliker, “Dispersive white-light interferometry for absolute distance measurement with dielectric multilayer systems on the target”, Opt. Lett. 21, 528-530 (1996).
[Crossref]
M. Urbánek, J. Spousta, T. Běhounek, and T. Šikola, “Imaging reflectometry in situ”, Appl. Opt. 46, 6309-6313 (2007).
[Crossref]
M. Urbánek, J. Spousta, T. Běhounek, and T. Šikola, “Imaging reflectometry in situ”, Appl. Opt. 46, 6309-6313 (2007).
[Crossref]
T. E. Benson, L. I. Kamlet, P. Klimecky, and F. L. Terry, JR, “In-situ spectroscopic reflectometry for polycrystalline silicon thin film etch rate determination during reactive ion etching”, J. Electron. Mater. 25, 955-964 (1996).
[Crossref]
M. Urbánek, J. Spousta, T. Běhounek, and T. Šikola, “Imaging reflectometry in situ”, Appl. Opt. 46, 6309-6313 (2007).
[Crossref]
T. Kihara and K. Yokomori, “Simultaneous measurement of refractive index and thickness of thin film by polarized reflectances”, Appl. Opt. 29, 5069-5073 (1990).
[Crossref]
Y.-M. Hwang, S.-W. Yoon, J.-H. Kim, S. Kim, and H.-J. Pahk, “Thin-film thickness profile measurement using wavelet transform in wavelength-scanning interferometry”, Opt. Laser. Eng. 46, 179-184 (2008).
[Crossref]
T. Kihara and K. Yokomori, “Simultaneous measurement of refractive index and thickness of thin film by polarized reflectances”, Appl. Opt. 29, 5069-5073 (1990).
[Crossref]
M. Urbánek, J. Spousta, T. Běhounek, and T. Šikola, “Imaging reflectometry in situ”, Appl. Opt. 46, 6309-6313 (2007).
[Crossref]
K. Kim, S. Kim, S. Kwon, and H. J. Pahk, “Volumetric thin film thickness measurement using spectroscopic imaging reflectometer and compensation of reflectance modeling error”, Int. J. Precis. Eng. Man. 15(9), 1817-1822 (2014).
[Crossref]
T. E. Benson, L. I. Kamlet, P. Klimecky, and F. L. Terry, JR, “In-situ spectroscopic reflectometry for polycrystalline silicon thin film etch rate determination during reactive ion etching”, J. Electron. Mater. 25, 955-964 (1996).
[Crossref]
M. Ohlidal, I. Ohlidal, P. Klapetek, D. Nečas, and A. Majumdar, “Measurement of the thickness distribution and optical constants of non-uniform thin films”, Meas. Sci. Technol. 22 (2011) 085104.
D. Kim, S. Kim, H. J. Kong, Y. Lee, and Y. K. Kwak, “Fast thickness profile measurement using a peak detection method based on an acousto-optic tunable filter”, Meas. Sci. Technol. 13 (2002) L1.
S. Kwon, N. Y. Kim, T. Jo, and H. J. Pahk, “Critical dimension measurement of transparent film layers by multispectral imaging”, Opt. Express 22, 17370-17381 (2014).
[Crossref]
Y.-M. Hwang, S.-W. Yoon, J.-H. Kim, S. Kim, and H.-J. Pahk, “Thin-film thickness profile measurement using wavelet transform in wavelength-scanning interferometry”, Opt. Laser. Eng. 46, 179-184 (2008).
[Crossref]
U. Schnell and R. Dӓndliker, “Dispersive white-light interferometry for absolute distance measurement with dielectric multilayer systems on the target”, Opt. Lett. 21, 528-530 (1996).
[Crossref]
A. Piegary and E. Masetti, “Thin film thickness measurement: a comparison of various techniques”, Thin Solid Films 124, 249-257 (1985).
[Crossref]
H. Fujiwara, Spectroscopic Ellipsometry: Principles and Applications, p. 43 (Wiley, New York, USA, 2007)
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