Abstract

This paper demonstrates an OPTOBUS1-based fully packaged optoelectronic cross-connect interconnect technique for data communication applications. Optical insertion loss of the compact 100100 cross-connect interconnect device ranges from 0.4 to 2.9 dB among all possible connections. Optical transmissions with bit error rate (BER) of >10 - 12 can be maintained at per channel bandwidth of 900 Mb/s. The system is expected to have an aggregated interconnect bandwidth near 100 Gb/s when being fully connected with the OPTOBUS chips.

[IEEE ]

Free-space–fiber hybrid distributed optical cross-connect interconnect module

Jan Popelek and Yao Li
Opt. Lett. 24(3) 142-144 (1999)

Three-dimensional optoelectronic stacked processor by use of free-space optical interconnection and three-dimensional VLSI chip stacks

Guoqiang Li, Dawei Huang, Emel Yuceturk, Philippe J. Marchand, Sadik C. Esener, Volkan H. Ozguz, and Yue Liu
Appl. Opt. 41(2) 348-360 (2002)

Experimental demonstration of the optical multi-mesh hypercube: scaleable interconnection network for multiprocessors and multicomputers

Ahmed Louri, Stephen Furlonge, and Costas Neocleous
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Demonstration of a multichannel optical interconnection by use of imaging fiber bundles butt coupled to optoelectronic circuits

Donald M. Chiarulli, Steven P. Levitan, Paige Derr, Robert Hofmann, Bryan Greiner, and Matt Robinson
Appl. Opt. 39(5) 698-703 (2000)

Parallel optical interconnects: implementation of optoelectronics in multiprocessor architectures

E. E. E. Frietman, W. van Nifterick, L. Dekker, and T. J. M. Jongeling
Appl. Opt. 29(8) 1161-1177 (1990)