Author Affiliations
N. A. Maleev1,2, A. G. Kuzmenkov1,3, M. M. Kulagina1,4, Yu. A. Guseva1,5, A. P. Vasil’ev6,7, S. A. Blokhin1,2,8, M. A. Bobrov1,9, S. I. Troshkov1,10, V. V. Andryushkin2,11, E. S. Kolodeznyi2,12, V. E. Bougrov2,13, V. M. Ustinov6,14
1A. F. Ioffe Physical-Technical Institute of the Russian Academy of Sciences, St. Petersburg, Russia
2ITMO University, St. Petersburg, Russia
3e-mail: kuzmenkov@mail.ioffe.ru (kuzmenkov@mail.ioffe.ru)
4e-mail: Marina.Kulagina@mail.ioffe.ru (Marina.Kulagina@mail.ioffe.ru)
5e-mail: Guseva.Julia@mail.ioffe.ru (Guseva.Julia@mail.ioffe.ru)
6Submicron Heterostructures for Microelectronics Research and Engineering Center of the Russian Academy of Sciences, St. Petersburg, Russia
7e-mail: Vasiljev@mail.ioffe.ru (Vasiljev@mail.ioffe.ru)
8e-mail: blokh@mail.ioffe.ru (blokh@mail.ioffe.ru)
9e-mail: bobrov.mikh@gmail.com (bobrov.mikh@gmail.com)
10e-mail: S.Troshkov@mail.ioffe.ru (S.Troshkov@mail.ioffe.ru)
11e-mail: vvandriushkin@itmo.ru (vvandriushkin@itmo.ru)
12e-mail: evgenii_kolodeznyi@itmo.ru (evgenii_kolodeznyi@itmo.ru)
13e-mail: vladislav.bougrov@niuitmo.ru (vladislav.bougrov@niuitmo.ru)
14e-mail: vmust@beam.ioffe.ru (vmust@beam.ioffe.ru)