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Promising low-damage fabrication method for the photonic crystals with hexagonal or triangular air holes: selective area metal organic vapor phase epitaxy

Lin Yang, Junichi Motohisa, Junichiro Takeda, and Takashi Fukui

Open Access Open Access

Abstract

The photonic band diagrams of the photonic crystal slabs (PCSs) with various structural air holes were calculated by plane wave expansion method with super cell method. The calculated results indicate that the PCSs with hexagonal or triangular air holes have enough large photonic band gaps in the guided mode spectrum, hence they are good candidates to be used for the PC devices. The PCs with hexagonal or triangular air holes were fabricated successfully on n-type GaAs (111)B substrate by selective-area metal organic vapor phase epitaxy (SA-MOVPE). Vertical and smooth facets are formed and the uniformities are very good. The same process was also used to fabricate hexagonal air hole arrays with the width of 100 nm successfully. A procedure was proposed and utilized to fabricate the air-bridge PCS with normal hexagonal air holes. The fabricated hexagonal air holes are very uniform and the sidewalls are smooth and vertical. Our experimental results indicate that SA-MOVPE growth is a promising low-damage fabrication method for PC devices and photonic nano-strucutres.

©2005 Optical Society of America

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Figures (6)
Fig. 1.
Fig. 1. Photonic gap maps in the guided mode spectrum for the PCSs with circular air holes (a), normal hexagonal air holes (b), orthogonal hexagonal air holes (c), square air holes (d), normal triangular air holes (e) and orthogonal triangular air holes (f). TE-like modes are shown in solid lines “—” and TM-like modes in dotted lines “…”.

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Fig. 2.
Fig. 2. Gap-mid and gap-ratio as the functions of the normalized sizes and filling fractions of the air holes. Solid square “■”is for the PCS with circular air holes, hollow square “□” for the PCS with normal hexagonal air holes, solid circle “●”for the PCS with orthogonal hexagonal air holes, Hollow circle “○” for the PCS with square air holes, solid triangle “▲” for the PCS with normal triangular air holes and hollow triangle “△” for the PCS with orthogonal triangular air holes.

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Fig. 3.
Fig. 3. SEM images for the patterned substrates of the PCs with normal hexagonal air holes (a), orthogonal hexagonal air holes (b), normal triangular air holes (c) and orthogonal triangular air holes (d).

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Fig. 4.
Fig. 4. SEM images for the fabricated PCs with normal hexagonal air holes (a), orthogonal hexagonal air holes (b), normal triangular air holes (c) and orthogonal triangular air holes (d).

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Fig. 5.
Fig. 5. (a) SEM image for the cross section of the fabricated PC with normal hexagonal air holes. (a) SEM image for the fabricated PC with normal hexagonal air holes. (b) and (c) SEM images for the fabricated PC waveguide with normal hexagonal air holes and the fabricated PC microcavity with normal hexagonal air holes. (d) SEM image for the fabricated PC with normal hexagonal air holes and a=200 nm and r=50 nm.

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Fig. 6.
Fig. 6. SEM images for the fabricated air-bridge PCS with hexagonal air holes (a=300 nm and r=90 nm) (a) and its cross section (b).

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