Abstract
Rapid and facile creation of three-dimensional (3D) microcoils array in a “lab-on-a-chip” platform is a big challenge in micromachining. Here we report a method based on an improved femtosecond-laser wet-etch (FLWE) technology and metal-microsolidifying process for the fabrication of 3D microcoils array inside fused silica. Based on this approach, we fabricated microcoil arrays such as O-shaped microcoils array and liner microcoils array. By injecting high-melting-point alloy, the electrocircuit of microcoils array can hardly be disconnected. The microcoils array also exhibits good uniformity and a high integration level. It shows promise as a real application device.
© 2015 Optical Society of America
Full Article | PDF ArticleMore Like This
Feng Chen, Chao Shan, Keyin Liu, Qing Yang, Xiangwei Meng, Shengguan He, Jinhai Si, Feng Yun, and Xun Hou
Opt. Lett. 38(15) 2911-2914 (2013)
Shengguan He, Feng Chen, Keyin Liu, Qing Yang, Hewei Liu, Hao Bian, Xiangwei Meng, Chao Shan, Jinhai Si, Yulong Zhao, and Xun Hou
Opt. Lett. 37(18) 3825-3827 (2012)
Ariel Schwarz, Jingang Wang, Amir Shemer, Zeev Zalevsky, and Bahram Javidi
Opt. Lett. 40(8) 1814-1817 (2015)