Author Affiliations

Jianan Duan,^1,* Yueguang Zhou,^1,6 Bozhang Dong,¹ Heming Huang,¹ Justin C. Norman,^2,3 Daehwan Jung,^3,5 Zeyu Zhang,⁴ Cheng Wang,⁶ John E. Bowers,^2,3,4 and Frédéric Grillot^1,7

¹LTCI, Télécom Paris, Institut Polytechnique de Paris, 19 place Marguerite Perey, 91120 Palaiseau, France

²Materials Department, University of California, Santa Barbara, California 93106, USA

³Institute for Energy Efficiency, University of California, Santa Barbara, California 93106, USA

⁴Department of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, California 93106, USA

⁵Center for Opto-electronic Materials and Devices, Korea Institute of Science and Technology, Seoul 02792, South Korea

⁶School of Information Science and Technology, Shanghai Tech University, Shanghai 201210, China

⁷Center for High Technology Materials, University of New Mexico, Albuquerque, New Mexico 87106, USA

^*Corresponding author: jianan.duan@telecom-paristech.fr

ORCID

Jianan Duan	https://orcid.org/0000-0001-7710-4287
Bozhang Dong	https://orcid.org/0000-0001-5826-6723
Justin C. Norman	https://orcid.org/0000-0001-7563-2959
Zeyu Zhang	https://orcid.org/0000-0002-7157-6272
Cheng Wang	https://orcid.org/0000-0002-3029-1166
John E. Bowers	https://orcid.org/0000-0003-4270-8296