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Single-chip hybrid integrated silicon photonics transmitter based on passive alignment

Mingjin Wang, Wenzhen Liu, Yuanbo Xu, Ting Fu, Jingxuan Chen, and Wanhua Zheng

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Abstract

A single-chip hybrid integrated silicon photonics transmitter based on passive alignment flip-chip bonding technology has been demonstrated. The transmitter is developed by the hybrid integration of a C-band slotted laser with 1 mm cavity length and a Mach–Zehnder modulator with 2 mm long phase shifter. A 3 dB bandwidth of the small signal response is 16.35 GHz at 5.99 VPP superimposed with a reverse bias voltage of 2.43 V. A 25 Gbps data transmission experiment of the hybrid integrated transmitter is performed at 25°C.

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Data availability

Data underlying the results presented in this Letter are not publicly available at this time but may be obtained from the authors upon reasonable request.

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