Optical Materials Express Feature issue
Photonics with 2D Materials
Submission Opens: 1 November 2022
Submission Deadline: 1 December 2022
2D materials and their heterostructures have transformed the current landscape of condensed matter physics research. The atomically thin nature of these materials has enabled researchers to predict their properties with high precision and allowed for analysis of their material properties with unprecedented control, such as stacking multiple layers, twisting, electrical gating and photo-doping. A new class of optoelectronic devices is now being developed using these materials for a myriad of applications including nonlinear photonics and integrated quantum photonics.
This feature issue will highlight recent advances in photonics using single- and few-layered 2D materials, and their heterostructures with a focus on non-classical light generation, exciton-polaritonics, integration with nano-photonic structures for light generation and detection as well as nonlinear photonics. Submissions on emerging topics such as moiré excitons, twistronics, topological photonics and chiral photonics exploiting spin-valley physics in 2D materials are also welcome.
Topics to be covered include but are not limited to:
- Quantum defects in 2D materials
- Exciton-polaritons and phonon-polaritons with 2D materials
- Nanophotonics integrated 2D materials
- Topological and chiral photonics with 2D materials
- Twistronics and valleytronics in 2D materials
- Moiré excitons in 2D materials
- Photonics and optoelectronics with lateral and vertical (van der Waals) heterostructures of 2D materials
- Nonlinear photonics with 2D materials
- Tunable metamaterial devices with 2D materials
Manuscripts must be prepared according to the usual guidelines for submission to Optical Materials Express and must be submitted online through the Prism submission system. When submitting, authors should specify that the manuscript is for the "Photonics with 2D Materials" feature issue (choose from the drop-down menu).
Feature Issue Guest EditorsArka Majumdar, Univ of Washington, USA (Lead Editor)
Hui Deng, Univ of Michigan, USA
Johannes Fröch, Univ of Washington, USA
Chang-Hua Liu, National Tsing Hua University, Taiwan
Donguk Nam, Nanyang Technological University, Singapore
Alexander Tartakovskii, University of Sheffield, UK