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Optical Materials Express Feature Issue

Photonics for Harsh Environments

Submissions open: 1 September 2022

Submissions close: 1 November 2022

Photonic technologies for computing, power, and sensing applications play an important role in harsh environments. They help us to better understand the performance and reliability of materials in, for example, radiation-rich environments (natural and man-made), supersonic/hypersonic flight, underground pipelines, and ultra-hot and cold regions. In fact, photonics in such extreme environments lie at the interface of photonics, mechanical engineering, materials engineering, and electrical engineering.

This feature issue will highlight recent advances in designing photonics for harsh environments such as space/vacuum, high pressure, extreme temperature, and/or supersonic/hypersonic speeds. Advanced materials and devices such as microwave/RF photonics, fiber lasers, image detectors, optical sensors, and photovoltaics will be featured. Submissions on emerging applications such as interactive windows and quantum photonic systems and other contributions that focus on characterization, performance, modelling and synthesis of materials and photonic devices suitable for harsh environments are welcome.

Topics to be covered include but are not limited to:

  • Optical materials for harsh environments, such as solar sails
  • Microwave/RF photonics in aerospace environments
  • Fiber lasers / laser materials in aerospace and pipeline environments
  • Image detector materials in aerospace, pipeline, and ultra-cold environments
  • Optical sensors/materials in aerospace, pipeline, ultra-hot, and ultra-cold environments
  • Photovoltaics/materials in aerospace and ultra-hot environments

Manuscripts must be prepared according to the usual guidelines for submission to Optical Materials Express and must be submitted online through the Prism submission system. When submitting, authors should specify that the manuscript is for the "Photonics for Harsh Environments" feature issue (choose from the drop-down menu).

Feature Issue Guest Editors

Peter Bermel, Purdue University, USA (Lead Editor)

Sylvain Girard, Université de Saint-Etienne, France

Juejun Hu, Massachusetts Institute of Technology, USA

Yiquan Wu, Alfred University, USA