Common-path digital holography microscopy of buried semiconductor specimen

Markus Finkeldey; Lena Göring; Nils C. Gerhardt; Martin R. Hofmann

doi:10.1364/3D.2016.JW4A.40

Imaging and Applied Optics 2016
OSA Technical Digest (online) (Optica Publishing Group, 2016),
paper JW4A.40
•https://doi.org/10.1364/3D.2016.JW4A.40

Common-path digital holography microscopy of buried semiconductor specimen

Markus Finkeldey, Lena Göring, Nils C. Gerhardt, and Martin R. Hofmann

3D Image Acquisition and Display: Technology, Perception and Applications 2016

Heidelberg Germany
25–28 July 2016
ISBN: 978-1-943580-15-6

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M. Finkeldey, L. Göring, N. C. Gerhardt, and M. R. Hofmann, "Common-path digital holography microscopy of buried semiconductor specimen," in Imaging and Applied Optics 2016, OSA Technical Digest (online) (Optica Publishing Group, 2016), paper JW4A.40.

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Abstract

We present a digital holographic microscopy setup for non-destructive 3D analysis of semiconductor devices. Our reflective geometry microscope uses the common-path technique to achieve high axial resolution and high phase stability.

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