Abstract
Recent progresses on hybrid integration of III-V on Silicon devices using a wafer bonding technique are presented as well as their applications for next generation of access, metropolitan and long haul networks.
© 2013 Optical Society of America
PDF ArticleMore Like This
G.-H. Duan, C. Jany, A. Le Liepvre, M. Lamponi, A. Accard, D. Make, F. Lelarge, S. Messaoudene, D. Bordel, J.-M. Fedeli, S. Keyvaninia, G. Roelkens, D. Van Thourhout, D. J. Thomson, F. Y. Gardes, and G. T. Reed
OM3K.4 Optical Fiber Communication Conference (OFC) 2013
G.-H. Duan, G. Levaufre, A. Shen, N. Girard, S. Olivier, S. Malhouitre, A. Accard, C. Jany, A. Le Liepvre, D. Make, F. Lelarge, J. Decobert, G. de Valicourt, K. Ribaud, and C. Kopp
IT1A.1 Integrated Photonics Research, Silicon and Nanophotonics (IPR) 2015
G. Roelkens, J. Brouckaert, J. Van Campenhout, D. Van Thourhout, and R. Baets
FThH3 Frontiers in Optics (FiO) 2007