Abstract
On printed circuits of high density for computer applications, conductor lines in x and y directions are often segregated into two different planes. The interconnection of line segments is done with plated-through holes, called vias. A typical multilayer printed circuit board may have several such signal cores, laminated to other conductor planes which carry power and ground connections. A high packing density is achieved by minimizing the spacing and dimensions of circuit lines.
© 1981 Optical Society of America
PDF ArticleMore Like This
S. D. Allen, M. Bass, and M. L. Teisinger
WL2 Conference on Lasers and Electro-Optics (CLEO:S&I) 1982
Yasunobu Matsuoka, Daichi Kawamura, Takuma Ban, Reiko Mita, Yong Lee, Koichiro Adachi, Toshiki Sugawara, Saori Hamamura, Naoki Matsushima, Norio Cyujyo, Tomoaki Shibata, Hiroshi Masuda, and Atsushi Takahashi
JThA58 National Fiber Optic Engineers Conference (NFOEC) 2010
Hsiu-Hao Tsai, Tsung-Lin Lu, and Tzung-Han Lin
ITu5E.4 Imaging Systems and Applications (IS) 2022