Abstract
The ablation of solid organic material by excimer lasers has received considerable interest primarily due to its potential microelectronic and surgical applications.1 Recently, excimer laser pulses as short as 300 fs with pulse energies of up to 15 mJ have become available at 248 nm.2 Ultrashort pulses allow the ablation of materials which are hardly accessible to ablation with standard excimer laser pulses of 16-ns pulse duration and, in addition, are essential for ultrafast mechanistic studies of the ablation process.3
© 1988 Optical Society of America
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