Efficient laser cleaning to remove 0.2 μm-sized gold particles on thin silicon wafers

Werner Zapka; Winfrid Ziemlich; Andrew C. Tam; Andrew C. Tam

Conference on Lasers and Electro-Optics
OSA Technical Digest (Optica Publishing Group, 1991),
paper CFL2

Efficient laser cleaning to remove 0.2 μm-sized gold particles on thin silicon wafers

Werner Zapka, Winfrid Ziemlich, and Andrew C. Tam

Conference on Lasers and Electro-Optics 1991

Baltimore, Maryland United States
12–17 May 1991
ISBN: 1-55752-189-1

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Laser Applications in Microelectronics (CFL)

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W. Zapka, W. Ziemlich, and A. C. Tam, "Efficient laser cleaning to remove 0.2 μm-sized gold particles on thin silicon wafers," in Conference on Lasers and Electro-Optics, J. Bufton, A. Glass, T. Hsu, and W. Krupke, eds., Vol. 10 of OSA Technical Digest (Optica Publishing Group, 1991), paper CFL2.

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Abstract

Laser cleaning techniques^1–3 demonstrated recently appear to be promising for practical removal of small particulate contaminations from solid surfaces. One focus of our work is on the cleaning of silicon membrane stencil masks that are to be used for e-beam lithography printing of DRAMs of 64 MBit and beyond.⁴ These masks contain the chip pattern as physical holes in a silicon membrane of thickness 2 μm. The cleaning challenge is to remove particles even out of the stencil holes while not damaging the sensitive membrane.

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